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SPECIFICATION
PART NO. : MT4164S4-HR6-2-A 4.8mm ROUND LED LAMP WITH HOLDER
MT4164S4-HR6-2-A
Package Dimensions
4.8mm ROUND LED LAMP WITH HOLDER
7.0
0.70
11.3 4.1
12.0 0.5
4.8
1.6
2.70
26AWG 142 2
Notes: 1. All dimensions are in mm. 2. Tolerance is 0.25mm unless otherwise noted
Description
LED Chip Part No.
Material GaAsP/GaP Emitting Color Hi-Effect Red
Lens Color
MT4164S4-HR6-2-A
Red Diffused
VER.: 01
Date: 2007/11/10 Page: 1/5
+
_
MT4164S4-HR6-2-A
Absolute Maximum Ratings at Ta=25
Parameter
Power Dissipation Reverse Voltage D.C. Forward Current Peak Current(1/10Duty duty,0.1ms Pulse Width.) Operating Temperature Range Storage Temperature Range Soldering Temperature(1.6mm from body)
4.8mm ROUND LED LAMP WITH HOLDER
Symbol
PD VR If If(Peak) Topr. Tstg. Tsol
Rating
78 5 30 100 -25 to +85 -40 to +100
Unit
mW V mA mA
Dip Soldering: 260 for 5sec. Hand Soldering: 350 for 3 sec.
Electrical and Optical Characteristics:
Parameter
Luminous Intensity Forward Voltage Peak Wavelength Dominant Wavelength Reverse Current Viewing Angle Spectrum Line Halfwidth 2
Symbol
IV Vf p d Ir 1/2
Condition
If=20mA If=20mA If=20mA If=20mA Vr=5V If=20mA If=20mA
Min.
24.0
Typ.
40.0 2.1 642 629
Max.
Unit
mcd
2.6
V nm nm
100 38 35
A deg nm
Note:The datas come from the SPEC. of LT6441R-81.
VER.: 01
Date: 2007/11/10 Page: 2/5
MT4164S4-HR6-2-A
4.8mm ROUND LED LAMP WITH HOLDER
Typical Electrical/Optical Characteristic Curves (25 Ambient Temperature Unless Otherwise Noted)
50
50
Forward Current IF(mA)
Relative Luminous Intensity
40 30 20 10
40 30 20 10 0
1.2
1.6
2.0
2.4
2.8
3.2
0.0
10.0
20.0
30.0
Applied Voltage (V) FORWARD CURRENT VS.APPLIED VOLTAGE
Forward Current (mA)
FORWARD CURRENT VS. LUMINOUS INTENSITY
0
50 40
10
20 30
Forward Current IF(mA)
40
30
1.0
20 10
0.9 0.8
50 60 70 80 90 0.5 0.3 0.1 0.2 0.4 0.6
0
20 40 60 Temperature( C)
80
100
0.7
FORWARD CURRENT VS. AMBIENT TEMPERATURE
RADIATION DIAGRAM
VER.: 01
Date: 2007/11/10 Page: 3/5
MT4164S4-HR6-2-A
Precautions:
TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use
4.8mm ROUND LED LAMP WITH HOLDER
Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130 . At a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) (2) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. Dip Soldering: Pre-heat: 90 (3) max. (Backside of PCB), Within 60 seconds. (Solder temperature), Within 5 seconds. max. (Temperature of soldering iron tip), Within 3 seconds Solder bath: 260 5 Hand Soldering : 350
3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120 max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature.
VER.: 01
Date: 2007/11/10 Page: 4/5

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